1995 Catalog Data: 14:650:478 Mechanical Engineering Aspects of Electronic Packaging(3 Credits)

The packaging of integrated circuits, printed circuit boards, and electronic equipment from consumer electronics and personal computers to large mainframe computers and telephone switching systems. Thermal analysis and design, stress analysis, shock and vibration, electrical analysis and design, materials, reliability, and failure mode analysis.

Corequisite: 650:481

Textbook: Packaging of Electronic Systems - A Mechanical Engineering Approach by J.W. Daly, McGraw-Hill

Coordinator: A. Saxena, Part-time lecturer of Mechanical and Aerospace Engineering

Goals:

Teach analysis of the packaging of electronic equipment and systems with respect to heat removal, strength and failure. Teach design of electronic systems for reliability and optimization.

Topics:

1. Overview of electronic packaging: the packaging hierarchy-chip level to system level. Definitions,driving forces, requirements and design consideration.
2. Integrated circuit packaging, single and multiple chips. Packaging technologies and package types.
3. Second level packaging-printed circuit boards.
4. System packaging-circuit boards, connectors, backplanes, cables, cabinets.
5. Heat transfer and fluid mechanics-a review of basic concepts. Thermal design considerations in electronic packaging.
6. Thermal characteristics of electronic equipment. temperature & humidity environmental conditions. Cooling methods. Thermal design and analysis. (3 classes)
7. Electrical design considerations. Basic concepts, design and analysis.
8. Shock and vibration, thermal and mechanical stresses, material mis-matches, stress analysis.
9. Electronic materials.
10. Manufacturing.
11. Design, development and CAD.
12. Reliability, qualification and failure mode analysis.
    

Design Projects:

Design projects consist of solutions to practical problems in electronic packaging encountered in the industry. They include: eliminating the numbers of silicon IC chips per wager as function of wire bond pad pitch and wafer size, develop the concept of thermal resistance of an IC device in terms of its usefulness to an electronic equipment designer, thermal resistance of glass epoxy printed circuit boards, thermal design of electronic equipment.

ABET category content:

Engineering science: 1.5 credits or 50%

Engineering design: 1.5 credits or 50%